极速赛车走势图开奖号码

极速赛车微信群

极速赛车官方开奖

极速赛车开奖视频

Our gold-tin alloy is suitable as a bonding material for high frequency devices and optical communication devices and as a substitute for high temperature lead-free solder. This gold-tin alloy not only can be supplied as brazing filler metals but also can be processed into sputtering targets and vapor deposition materials. In addition, the gold-tin alloy can be fused, only in the quantity needed, to metals or ceramics and shipped as fusion products.

极速赛车结果号码查询

  • Gold-tin alloys of various compositions are available to suit each application.
  • Improved gold-rich layer
  • Excellent sealing reliability with fewer defects such as voids
  • Sealed devices can be mounted on circuit boards using lead-free solder.

极速赛车官方网址

Composition Melting point Vickers hardness Specific gravity
AuSn18 278-360℃ 145 14.89
AuSn20 278-300℃ 135 14.52
AuSn21 278℃ 135 14.35
AuSn21.5 278℃ 135 14.26
AuSn90 217℃ 17 7.78

Compositions other than those listed above are available.

极速赛车平台

Shape Minimum dimensions
Ribbon 15µm thick
Preform 15µm thick
Wire φ0.06mm
Ball φ0.1mm
Sputtering target 2.5mm thick

The minimum dimension differs depending on the type, composition, shape, etc.

极速赛车预测

Semiconductor laser modules, optical devices, SAW filters, crystal oscillators, microwave radar components, lead frames, lead pins, ceramic packages, etc.

极速赛车彩票app

Gold-tin brazing lids for crystal oscillating devices (Window type)

极速赛车软件下载

极速赛车开奖结果

  • The gold rich layer can be improved (bonding and sealing properties) by optimally adjusting gold and tin compositions according to the thickness of gold on the material surface.
  • Can be fused not only to ceramics but also to metalized substrates and conductive surfaces.
  • High dimensional accuracy with up-to-date equipment
  • Shorter assembly process and improved product yields
Changes in the cross-sectional structure of the lid with different Au/Sn compositions
AuSn20

AuSn20

AuSn21.5

AuSn21.5

极速赛车彩开奖

  • Customer supplied materials
    • Conductive surfaces of ceramics
    • Heat sinks and lead frames
    • Semiconductor or compound devices
  • Lead pins (Ni/Au plating) … Base materials: Kov, FeNi, Cu, Fe, etc.
  • Lids (plates/stamped pieces) … Base materials: ceramic, Kov, FeNi, etc.
  • Gold-tin brazing lids for package sealing (left picture)
  • Our developed lid for sealing small crystal oscillating devices (Window type) is designed so that gold-tin alloy does not flow into the lid when it is sealed, providing a highly reliable seal with a smaller amount of gold-tin alloy.

极速赛车分析

New product “SKe-Lid”
*Registered Trademark

Glass lid with gold-tin (AuSn) for use with SMD type diodes

SG飞艇计划全天 秒速飞艇计划 SG飞艇开奖结果网址