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We can suggest high-performanceplating processes.

We offer various plating processes, including those using precious metal plating solutions, for various applications from semiconductor components to decorative articles. We offer highly productive plating processes with plating characteristics appropriate for their intended use.

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The superior bondability, heat resistance, and solderability of this series make them ideal for semiconductor components. Excellent thickness uniformity at a low gold concentration, enabling reduced Au consumption.

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Gold electroplating process for wafer bumps. This series has excellent thickness uniformity, enabling plating with a high current density and low operation temperatures.

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Non-cyanide Au plating for wafers. This series provides excellent properties for bump and fine pattern formation.

Process name Application Features
PRECIOUSFAB Au 8400 Bonding pad areas Good uniform electrodeposition,
Neutral cyanide
PRECIOUSFAB Au-MLA300 Low gold concentration,
Ni elution prevention, Neutral cyanide
PRECIOUSFAB Au-GB5 Wafers (bump) Low operation temperature,
Neutral cyanide
MICROFAB Au310 Wafers (wiring) Very fine surface roughness,
Neutral non-cyanide
MICROFAB AuFL2100 Low gold concentration,
Neutral non-cyanide
MICROFAB Au660 Wafers(bump) Low hardness, high-speed,
Neutral non-cyanide
MICROFAB Au3151 High hardness, high-speed,
Neutral non-cyanide

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Excellent electrical properties, abrasion resistance, corrosion resistance, and solderability. This series is suitable for connectors and other electronic components.

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Electrolytic gold-tin alloy process. This series allows easy adjustment of alloy ratios, making it possible to adjust them according to their melting temperatures.

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Electrolytic gold-silver alloy process. This series has both the corrosion resistance of gold and reflectivity of silver, making them ideal for LED components.

Process name Application
Features
Au-Co PRECIOUSFAB HG-GVC Connectors, PWB Acidity cyanide
PRECIOUSFAB HG-ICC7 Ni barrier property, Acidity cyanide
FINE BARRIER 7000 Ni barrier property, Acidity cyanide
Au-Ni PRECIOUSFAB HG-GVN Connectors, PWB Acidity cyanide
PRECIOUSFAB HG-ICN100 Ni barrier property, Acidity cyanide
Au-Sn20% PRECIOUSFAB GT1000 Alternative to coalescent Acidity cyanide
Au-Ag50% PRECIOUSFAB GS3000 Lead frames Alkali cyanide

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With “Au-ST400” (Chlorine free), stainless steel can be plated directly in a strongly acid strike bath.

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Non-cyanide type strike bath.

Process name Application Features
PRECIOUSFAB Au-ST100 General use Acidity cyanide
K-130AF Acidity cyanide, Mildew-proofing
PRECIOUSFAB Au-ST400 SUS materials Chlorine-free, Strong acidity cyanide
N-205 High gloss, Strong acidity cyanide
MICROFAB Au NX-ST Wafer Neutral non-cyanide

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Excellent adhesion and solder wettability on electroless Ni plating.
“IG100” develops uniform film thickness on Pd film.

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Self-reduction type thick Pb-free electroless gold plating process.

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Non-cyanide electroless gold plating process applied to electrolytic and electroless Ni plating.

Process name Application Features
IM MEISTER Au1100S Bonding pad areas Immersion thin plating, Cyanide
IM MEISTER AuFX5 Immersion thick plating, Cyanide
IM MEISTER Au-IG100 Uniform immersion thick Pd plating,
Cyanide
IM MEISTER Au-IGS2020 Uniform immersion thick Pd plating,
Non-cyanide
ATOMEX Ceramic parts, etc. Immersion thin plating, Cyanide
CERAGOLD 6070 Reduction thick plating, Pb-free,
Cyanide
SUPERMEX 250 Wafers, general use Immersion thin plating, Non-cyanide
SUPERMEX 850 Reduction thick plating, Non-cyanide

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Process name Application Features
Ag-10 General use Hard, High cyanide
LED BRIGHT Ag-20 LEDs and others Gloss, High cyanide
SP-4000 Lead frames Under high current density, Low cyanide

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Process name Application Features
PRECIOUSFAB Ag4730 Wafer Non-cyanide

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The “AD series” is a palladium plating process with less ammonia odor, which is friendly to the work environment and offers excellent corrosion resistance at high temperatures.

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Platinum plating process that enables thick plating with low stress and crackless.

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Plating process that enables decorative plating for industrial use.

Process name Application Features
 Pd  BELLPLATE Decorative articles White bright surface
PRECIOUSFAB Pd-ADP720 Lead frames
(Pd-PPF)
Thin-film high heat resistance
PRECIOUSFAB Pd-ADG820
PRECIOUSFAB Pd82GVE Connectors Pd-Ni 20% alloy
PRECIOUSFAB PC200 Probe pins Pd-Co 20% alloy
MICROFAB Pd700 Wafers (bump) Neutral, thick plating
Pd-LF-800S General use Strike – Thick plating
Pt PRECIOUSFAB Pt3LS Electronic
components
Acidity
PRECIOUSFAB Pt2000 Acidity, High corrosion resistance
PRECIOUSFAB Pt3000 Wafer Mild acidity
Rh PRECIOUSFAB Rh200 Electronic
components
Low stress, High hardness
PRECIOUSFAB Rh2000 Decorative articles White surfaces
Ru PRECIOUSFAB Ru1000 Electronic
components
Acidity, Low Ru concentration
Ir PRECIOUSFAB Ir300 High hardness
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