极速赛车安卓手机软件

极速赛车单双

极速赛车开奖结果助手

极速赛车走势图

Our bumping wires are available with bump formation methods for increasingly smaller, thinner, and higher-density electronics packaging. Bumps can be formed on semiconductor devices, such as ICs and LSIs, and other microelectronic devices at a lower cost and with fewer irregularities.

极速赛车开奖预测

  • Bumps can be formed with a minimum variance in neck height
  • Bumps can be formed with a minimum variance in shape
  • Suitable for small-volume production

极速赛车全天计划单期

极速赛车开奖走势

极速赛车官方开奖

  • In the high temperature storage test (200°C), the shear strength after bump formation, decreases less than other bumping wires (GBC)

极速赛车计划网

极速赛车3期计划

极速赛车官方开奖

  • Chips are not damaged during bump formation
Neck Height

Neck Height

Bump Shape

Bump Shape

极速赛车精准预测

Contact us for further information or materials (24 hours a day)
快乐飞艇网 SG飞艇龙虎走势图 澳洲5历史开奖 澳洲幸运10开奖软件下载 澳洲10历史记录 澳洲10官方开奖号码 澳洲5精准前三 极速飞艇人工全天计划