- Gold-tin alloys of various compositions are available to suit each application.
- Improved gold-rich layer
- Excellent sealing reliability with fewer defects such as voids
- Sealed devices can be mounted on circuit boards using lead-free solder.
|Composition||Melting point||Vickers hardness||Specific gravity|
Compositions other than those listed above are available.
|Sputtering target||2.5mm thick|
The minimum dimension differs depending on the type, composition, shape, etc.
Semiconductor laser modules, optical devices, SAW filters, crystal oscillators, microwave radar components, lead frames, lead pins, ceramic packages, etc.
- The gold rich layer can be improved (bonding and sealing properties) by optimally adjusting gold and tin compositions according to the thickness of gold on the material surface.
- Can be fused not only to ceramics but also to metalized substrates and conductive surfaces.
- High dimensional accuracy with up-to-date equipment
- Shorter assembly process and improved product yields
- Customer supplied materials
- Conductive surfaces of ceramics
- Heat sinks and lead frames
- Semiconductor or compound devices
- Lead pins (Ni/Au plating) … Base materials: Kov, FeNi, Cu, Fe, etc.
- Lids (plates/stamped pieces) … Base materials: ceramic, Kov, FeNi, etc.
- Gold-tin brazing lids for package sealing (left picture)
- Our developed lid for sealing small crystal oscillating devices (Window type) is designed so that gold-tin alloy does not flow into the lid when it is sealed, providing a highly reliable seal with a smaller amount of gold-tin alloy.
New product “SKe-Lid”
Glass lid with gold-tin (AuSn) for use with SMD type diodes